Boulahrouz, SalimChehhat, AbdelmadjidChahaoui, OualidGhelani, LaalaChermime, BrahimAboudi, Abdelaziz2019-05-232019-05-232018-12-10http://dspace.univ-eloued.dz/handle/123456789/1435International Symposium on Mechatronics and Renewable Energies El-Oued 10- 11 December 2018This study presents a CFD simulation by COMSOL multiphysics software of a metal foam heat sink used for cooling electronic power component. The simulation is a transient 3D of air laminar flow through a channel equipped with a plate-electronic component system cooled by a metal foam heat sink. The goal is to determine the thermohydraulic behavior of the system. The foam heat sink is considered as a porous medium, the Darcy-Forchheimer-Brinkman model is used. We discussed the effects of air velocity, heat flux dissipated by the electronic device and the type of metal foam on the system phenomenology.enmetallic foam, heat sink, comsol, simulation.Other